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Standard Packaging Integrated Circuit Components 573300D00000G
Width | 1.030" (26.16mm) |
---|---|
Type | Top Mount |
Thermal Resistance @ Natural | 18.00°C/W |
Thermal Resistance @ Forced Air Flow | 8.00°C/W @ 300 LFM |
Shape | Rectangular, Fins |
Series | - |
Power Dissipation @ Temperature Rise | 1.3W @ 30°C |
Package Cooled | TO-263 (D²Pak) |
Other Names | 041643 573300D00000G-ND HS408 |
Moisture Sensitivity Level (MSL) | Not Applicable |
Material Finish | Tin |
Material | Copper |
Manufacturer Standard Lead Time | 7 Weeks |
Length | 0.500" (12.70mm) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Height Off Base (Height of Fin) | 0.400" (10.16mm) |
Diameter | - |
Detailed Description | Heat Sink TO-263 (D²Pak) Copper 1.3W @ 30°C Top Mount |
Attachment Method | SMD Pad |