Label and body marking of TGF600M can be provided after order.
In stock: 56907
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Standard Packaging Integrated Circuit Components TGF600M
Usage | - |
---|---|
Type | Gap Filler Pad, Sheet |
Thickness | 0.118" (3.00mm) |
Thermal Resistivity | - |
Thermal Conductivity | 6.0 W/m-K |
Shape | Rectangular |
Series | - |
Outline | 298.45mm x 200.03mm |
Material | Silicone |
Manufacturer Standard Lead Time | 4 Weeks |
Detailed Description | Thermal Pad Brown 298.45mm x 200.03mm Rectangular |
Color | Brown |
Backing, Carrier | - |
Adhesive | - |