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Standard Packaging Integrated Circuit Components TGF50-07870787-039
Usage | - |
---|---|
Type | Gap Filler Pad, Sheet |
Thickness | 0.0390" (0.991mm) |
Thermal Resistivity | 0.70°C/W |
Thermal Conductivity | 5.0 W/m-K |
Shape | Square |
Series | TGF50 |
Outline | 199.90mm x 199.90mm |
Other Names | 1798-1265 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material | Aluminum Oxide filled Silicone |
Manufacturer Standard Lead Time | 5 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Thermal Pad White 199.90mm x 199.90mm Square Tacky - Both Sides |
Color | White |
Backing, Carrier | - |
Adhesive | Tacky - Both Sides |