In stock: 51126
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Standard Packaging Integrated Circuit Components H2F1.97BK25
Wall Thickness - Nonrecovered | - |
---|---|
Shrinkage Ratio | 2 to 1 |
Series | Shrinkflex |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Manufacturer Standard Lead Time | 3 Weeks |
Length | 25.00' (7.62m) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Diameter - Inner, Supplied | 1.97" (50.0mm) |
Diameter - Inner, Recovered | 0.98" (24.9mm) |
Detailed Description | Fabric Heat Shrink 2 to 1 1.97" (50.0mm) x 25.00' (7.62m) |
Color | Black |