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Standard Packaging Integrated Circuit Components H2F1.18BK
Wall Thickness - Nonrecovered | - |
---|---|
Shrinkage Ratio | 2 to 1 |
Series | Shrinkflex |
Other Names | 1030-1372 H2F1.18BK-ND |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Manufacturer Standard Lead Time | 3 Weeks |
Length | 100.0' (30.5m) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Diameter - Inner, Supplied | 1.18" (30.0mm) |
Diameter - Inner, Recovered | 0.59" (15.0mm) |
Detailed Description | Fabric Heat Shrink 2 to 1 1.18" (30.0mm) x 100.0' (30.5m) |
Color | Black |