Label and body marking of CHB2MIG-X can be provided after order.
In stock: 55335
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Standard Packaging Integrated Circuit Components CHB2MIG-X
Type | Blank Insert, Module |
---|---|
Size / Dimension | - |
Series | Mini-Com® |
Moisture Sensitivity Level (MSL) | Not Applicable |
Material | Acrylonitrile Butadiene Styrene (ABS) |
Manufacturer Standard Lead Time | 4 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
For Use With/Related Products | Mini-Com® Series (Flat, Sloped, Sloped Recessed or Blank) |
Detailed Description | Connector Blank Insert, Module Gray For Mini-Com® Series (Flat, Sloped, Sloped Recessed or Blank) |
Color | Gray |