In stock: 200
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Standard Packaging Integrated Circuit Components CHB2MIW-X
Type | Blank Insert, Module |
---|---|
Size / Dimension | - |
Series | Mini-Com® |
Other Names | CHB2MIW-X-ND |
Moisture Sensitivity Level (MSL) | Not Applicable |
Material | Acrylonitrile Butadiene Styrene (ABS) |
Manufacturer Standard Lead Time | 4 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
For Use With/Related Products | Mini-Com® Series (Flat, Sloped, Sloped Recessed or Blank) |
Detailed Description | Connector Blank Insert, Module White, Off For Mini-Com® Series (Flat, Sloped, Sloped Recessed or Blank) |
Color | White, Off |