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Standard Packaging Integrated Circuit Components SP900S-0.009-00-25
Usage | DO-5 |
---|---|
Type | Pad, Sheet |
Thickness | 0.0090" (0.229mm) |
Thermal Resistivity | 0.61°C/W |
Thermal Conductivity | 1.6 W/m-K |
Shape | Round |
Series | Sil-Pad® 900-S |
Outline | 25.40mm x 6.60mm |
Other Names | BER173 SP900-25 SP900S-25 SP900S00090025 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material | Silicone Rubber |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Thermal Pad Pink 25.40mm x 6.60mm Round |
Color | Pink |
Backing, Carrier | Fiberglass |
Adhesive | - |