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Standard Packaging Integrated Circuit Components SP900S-0.009-00-114
Usage | TO-218, TO-220, TO-247 |
---|---|
Type | Pad, Sheet |
Thickness | 0.0090" (0.229mm) |
Thermal Resistivity | 0.61°C/W |
Thermal Conductivity | 1.6 W/m-K |
Shape | Rectangular |
Series | Sil-Pad® 900-S |
Outline | 24.00mm x 21.01mm |
Other Names | BER180 BG426860 SP900-114 SP900S-114 SP900S000900114 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material | Silicone Rubber |
Manufacturer Standard Lead Time | 2 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Thermal Pad Pink 24.00mm x 21.01mm Rectangular |
Color | Pink |
Backing, Carrier | Fiberglass |
Adhesive | - |