If we disassemble it, we will have a green board. Everyone knows that this green board is called circuit board. The official name is called the printed circuit board, that is, PCB (Printed Circuit Board, sometimes it is also called PWB, Printed Wire Board).
On PCB, many electronic components are welded, such as capacitors, resistors, and inductors.
There are some black square components. This component is likely to be a chip (English name is CHIP), sometimes blue or black.
Chip is actually a relatively general name.
For electronic devices, it is hidden inside, which is very important. It is equivalent to the engine of the car and the heart of the human person, so it is called "core". From the perspective of form, it is piece by piece, so it is called "film". Combining is "chip".
Generally speaking, the chip is an integrated circuit. The two can be divided between the two and replaced each other.
Integrated circuits are relatively easy to define. Through specific technologies, electronic components such as transistors, resistors, capacitors, diode, and other electronic components are integrated on a single substrate to form a micro -circuit, which is called an integrated circuit.
If this substrate uses semiconductor materials (such as silicon), or the integrated circuit is made from semiconductor material wafers, it belongs to the semiconductor integrated circuit.
The integrated circuits we say in the traditional sense basically refer to semiconductor integrated circuits. Sometimes three words, semiconductors, chips, and integrated circuits are often mixed.
Working principle of semiconductor chip
The most basic component of the semiconductor chip is the transistor. The crystal tube consists of three areas: source, drain, and gate. There is a very thin semiconductor layer between the source and the drain, called the channel. The electric field in the gate control channel controls the flow of current.
The manufacturing process of semiconductor chips
The manufacturing process of semiconductor chips is a complex project. The following is a simple summary:
Raw material preparation: The main raw material of semiconductor chips is silicon, which usually appears in the form of polysilicon. Silicon materials need to be purified and fused to ensure its quality.
Walling: Walls are the basis of semiconductor chips, usually a round silicon wafer with 8 -inch or 12 -inch diameter. Making wafers requires multiple steps, including cutting, polishing and cleaning.
Mascular preparation: Mask is one of the key steps in the manufacturing of semiconductor chips. The mask is a kind of photoresistic, which is used to transfer the design pattern to the wafer surface. The mask needs to be prepared in a dry and clean environment.
Lights: During the light carvings, the mask is placed on the wafer and then illuminates the light. The light will harden the light carvings, forming a template, so that the subsequent steps can be operated according to this template.
Captive: Etquet is a process of engraving the area that is not covered by light -carved glue on the wafer. Chemical gas deposition and physical gas deposition technology are usually used for etching.
Cleaning and testing: During the manufacturing of semiconductor chips, the wafer must be cleaned and tested multiple times. This can ensure that there are no pollutants or defects on the wafer, thereby ensuring the quality and reliability of the chip.
Packaging: After the chip manufacturing is completed, they need to be packaged to integrate into electronic devices. Packaging usually includes the chip placed in a plastic or ceramic packaging, and connects the electrode and pin.
Future Outlook
With the continuous development of technology, semiconductor chips will still play an important role in future development and application.
Smaller and faster chips: With the continuous improvement of manufacturing technology, future semiconductor chips will become slightly tiny and faster. This will further improve the performance and functions of electronic equipment.
More advanced chips: Future semiconductor chips will have higher -level functions, such as artificial intelligence, deep learning, machine learning, etc. This will enable electronic devices to better understand human needs and provide more advanced services.
Sustainability: With the continuous increase in the environment of the society, the future semiconductor chips will pay more attention to sustainability. This will include reducing the impact on the environment, improving energy efficiency, and reducing the production of waste.
Expansion in the field of application: The application field of semiconductor chips in the future will be further expanded, such as medical equipment, industrial equipment, and smart city equipment. This will make semiconductor chips more widely used in future development.
As the core component of modern electronic equipment, semiconductor chips play a vital role in modern technology. By introducing the manufacturing process, principles, applications, and future prospects of semiconductor chips, we can better understand the basic knowledge and development trends in this field.
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