Patch packaging is one of the most widely used packaging methods. Its small size, light weight, excellent performance, and available production can be widely used in modern electronic manufacturing. There are two forms of patch packaging: lead -free packaging and lead packaging. Among them, lead -free packaging has the characteristics of environmental protection and high reliability, and has been widely used in various electronic devices. Leaded packaging is mainly used for some traditional electronic equipment. The production process is relatively simple and the cost is low.
Plug -in packaging is a traditional packaging method. Its manufacturing process is relatively simple, mainly for electronic components with special requirements such as high -power, high voltage, and high frequency. Plug -in packaging is divided into two types: direct insertion and curved feet. Among them, the direct -inserted packaging has the characteristics of simple manufacturing and easy to install, and the curved foot packaging can improve the compactness of the circuit layout and apply to the application of high -density circuit boards.
Ball array packaging (BGA) is a newer packaging method. Its size is smaller and the power density is larger. It is suitable for integrated circuit devices with high -speed, large -capacity, and high -performance. The BGA packaging uses spherical welding joints to connect the circuit board, making the connection of the circuit board's signals and power supply more stable and reliable. It is widely used in high -end electronic devices, such as smartphones and laptops.
The size and packaging method of commonly used electronic components:
Diodes: Generally, surface paste (SMT) packaging, the size is 0805, 1206, SOD-123, etc.
Trivers: Generally use surface stickers (SMT) and plug-in (TH) packaging, and the size is SOT-23, SOT-89, to-92, etc.
Integrated circuits: Generally, surface stickers (SMT) packaging is usually packaged, and the size is QFN, QFP, SOP, SSOP, TSSOP, etc.
Capacitors: Generally, surface paste (SMT) packaging, the size is 0402, 0603, 0805, 1206, etc.
Resistors: Generally, surface paste (SMT) packaging, the size is 0402, 0603, 0805, 1206, etc.
Crystal oscillator: Usually surface stickers (SMT) packaging, the size is 3225, 2520, 2016, etc.
LED lamp beads: Generally use surface stickers (SMT) packaging, and the size is 0603, 0805, 1206, etc.
MOS tube: Generally use surface stickers (SMT) and insert (TH) packaging, and the size is SOT-23, SOT-223, to-220, etc.
Electrochemicals: Generally, surface paste (SMT) packaging, the size is 0603, 0805, 1008, etc.
These are just common packaging methods and sizes, and there will be more different packaging methods and sizes in practical applications.
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