The wafer semiconductor chip completed through the previous section -all cutting, these cut chips are called Bare Chip or grains (DIE), but the chip in this state cannot be switched with external signals, so it is easy to be easy Evaluated by external impact, causing damage.
In order to install the semiconductor chip or integrated circuit (IC) on a substrate or electronic device, it is necessary to pack it accordingly. In order to make semiconductor chips and external switching signals to make channels, and the technology of protecting chip security in a variety of external environments is called packaging process.
Packaging is a process that connects integrated circuits and electronic equipment and protects the circuit from the external environment (such as high temperature, high humidity, chemicals and vibration/impact, etc.) damage.
1.Wall cutting
First, the wafer is separated into a separate chip. Hundreds of chips are arranged densely on a wafer, and each chip is separated by scribeline. Then follow the thread groove to cut the wafer with diamond saw or laser. Because this process is cutting wafers, the wafer cut operation is also called "Wafersawing" or "Dicing".
2.chip sticker (DIE ATTATCH)
The cut chip will be transferred to the lead frame or printed circuit board (PCB). The leading framework transmits electrical signals between semiconductor chips and external circuits, and play a role in protecting and supporting chips in the external environment.
3.chip interconnection
Wire Bonding is to achieve the electrical characteristics of semiconductor, using the fine gold wire to connect the contact of the semiconductor chip on the substrate with the petition of the substrate.
In addition to the traditional method of line -bonding, there is also a packaging method. It connects the chip circuit to the substrate convex point (BUMP) to increase the speed of semiconductor. This technology is called Flip Chip encapsulation. Compared with the lead key, its resistance is smaller and faster, and the Form Factor is made. The raised materials are mainly gold (AU) or solder (tin/lead/silver compound).
4.MOLDING process
When the chip interconnection is completed, the protection of the semiconductor integrated circuit is not affected by the physical environment such as heating and moisture, and the package is made into an ideal form. This process is called the molding process. After the completion of the interconnect, the semiconductor chip, which is sealed by chemical resin, will become our common semiconductor.
The semiconductor chip that completes the packaging process. The semiconductor made after the final test is used to put all the places in our lives.
After the packaging process is completed, the packaging test will be performed to qualify if the semiconductor product is finally screened. The test is checked after the finished product is formed, so it is also called "final test".
The packaging test is measured in the inspection device (TESTER), and under different conditions (voltage, electrical signal, temperature, humidity, etc.) measured the electrical specialty, functional characteristics and operating speed of the product. It can also improve product quality by analyzing test data, feedback to the manufacturing process or assembly process.
So far, we have learned the 8 major technologies of the birth of semiconductors. From a disc -shaped chip of cutting silicon ingot to a semiconductor that is smaller than nails. After complex and meticulous process, it is finally used in our daily life. Looking forward to the continuous development of semiconductors everywhere, making our lives more colorful!
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