Over the past year, our company has announced significant strategic investments to expand 300-mm wafer fab manufacturing capacity to support the continued growth of semiconductors in electronics for decades to come.

To complement these investments in our front-end semiconductor manufacturing process and extend our global internal manufacturing footprint, our company is expanding our back-end manufacturing operations, or assembly and test sites. Our assembly and test sites – where individual semiconductor products are separated from the wafer and assembled, packaged and tested – are a key part of our internal manufacturing operations and are undergoing continuous expansion, modernization and automation to support customer demand.