Semiconductor chips are tested to screen out defective products before they are released as products. The "packaging" process that each chip must pass through to become a perfect semiconductor product. The main function of packaging is to electrically connect and protect semiconductor chips from components.

The wafer completed through the previous steps is diced into individual semiconductor chips. Each of these individually diced chips is called a die or die. But at this stage, the chip cannot exchange electrical signals with the outside world, and is easily damaged by external shocks. For a semiconductor chip (integrated circuit) to be mounted on a substrate or electronic device, it first needs to be packaged accordingly. The process of opening a "path" for a semiconductor chip to exchange signals with the outside world and protecting it from various external factors is called "packaging". The purpose of packaging is to connect integrated circuits to electronic devices and to protect circuits from: high temperature, high humidity, chemical agents, shock and vibration, etc.

1)Wafer cutting

First, the wafer needs to be separated into individual chips. A wafer contains hundreds of chips, each marked with a scribe line. Stone dicing machines are used to cut wafers along these scribe lines.
2)Patch



The diced chips are moved onto a lead frame or printed circuit board (PCB). The lead frame acts as a frame that protects and supports the chip, and transmits electrical signals between the semiconductor chip and external circuits.

3)Wire bonding

Connecting the contact points of the semiconductor chip placed on the substrate with the contact points of the substrate using thin wires to give the chip electrical characteristics is called wire bonding.
In addition to the traditional wire bonding method, there is another packaging method that uses ball bumps to connect the circuit of the chip and the substrate. This increases semiconductor speed. This technique, called flip-chip packaging, offers lower resistance, faster speed and smaller form factor than wire bonding. Bumps are usually made of gold (Au) or solder (a compound of tin, lead, and silver).
4)Packaging and testing: the last step towards a perfect semiconductor chip

Packaged semiconductor chips. Finished chips undergo final testing before being released for widespread use in everyday applications.

Finally, the semiconductor chip is completed. Packaging testing is performed after packaging to screen out defective semiconductor chips. This test is also known as the final test because it is performed on the finished product. Semiconductor chips are placed in the tester and subjected to various voltages, electrical signals, temperature and different humidity levels to test the electrical characteristics, functional characteristics and operating speed of the product. Data from the tester is analyzed and fed back into the manufacturing or assembly process, further improving product quality. Advances in semiconductor technology promise to further enrich our lives.