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HomeNewsThe role of hybrid signal IC

The role of hybrid signal IC

Feb28
Modern IC usually consists of components in various fields. There are also various film system (SOC) and system -level packaging (SIP) technology, including each IC design domain on a single IC, or packaging in various semiconductor processes and sub -ICs.

For compact and complicated wireless communication and sensing hardware (such as automotive radar), this situation is becoming more and more common, among which a single device performs extensive sensing, processing, conversion, mathematical operations, storage, decision -making, and communication.

These hybrid signal design usually involves multiple teams. These teams must use some unified EDA tools to ensure that every aspect of the design follows the process constraints. This is becoming more and more important, because because of the relatively poor optimization of these fields, these SOC processes are often difficult to meet simulation and RF performance standards.

With the new IoT, wireless communication (such as Wi-Fi, 5G honeycomb, LORA, etc.) and sensing technology, the hybrid signal IC is becoming increasingly complicated, and the EDA tools and casting processes are constantly improving to meet these new application needs.

Mixed signal IC design process
Design of specific fields
Sims/Retoscopic frequency
Principle diagram capture
Simulation
digital
Design
Behavioral simulation
Hybrid signal analysis
Physical design
Sims/Retoscopic frequency
Physical layout
Physical verification
Simulation after layout
digital
synthesis
Location and route
Functional Verification
Full chip assembly and physical verification
Mixed signal function verification
Stream


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