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Standard Packaging Integrated Circuit Components PH3N-101.6-38.1-0.07-1A
Width | 1.500" (38.10mm) |
---|---|
Type | Heat Spreader |
Thermal Resistance @ Natural | - |
Thermal Resistance @ Forced Air Flow | - |
Shape | Rectangular |
Series | PH3n |
Power Dissipation @ Temperature Rise | - |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Other Names | 1168-2069 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material Finish | Polyester |
Material | Copper |
Manufacturer Standard Lead Time | 12 Weeks |
Length | 4.000" (101.60mm) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Height Off Base (Height of Fin) | 0.003" (0.07mm) |
Diameter | - |
Detailed Description | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader |
Attachment Method | Adhesive |