In stock: 56733
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Standard Packaging Integrated Circuit Components HDAF-11-18.0-S-13-1
Series | HD Mezz™ HDAF |
---|---|
Pitch | 0.047" (1.20mm) |
Packaging | Tray |
Other Names | SAM8656 |
Number of Rows | 13 |
Number of Positions | 143 |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Mated Stacking Heights | 30mm, 35mm |
Manufacturer Standard Lead Time | 3 Weeks |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant |
Height Above Board | 0.807" (20.51mm) |
Features | Board Guide |
Detailed Description | 143 Position Connector High Density Array, Female Surface Mount Gold |
Contact Finish Thickness | 30.0µin (0.76µm) |
Contact Finish | Gold |
Connector Type | High Density Array, Female |