Label and body marking of TGF25-07870787-079 can be provided after order.
In stock: 57295
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Standard Packaging Integrated Circuit Components TGF25-07870787-079
Usage | - |
---|---|
Type | Gap Filler Pad, Sheet |
Thickness | 0.0790" (2.007mm) |
Thermal Resistivity | 1.00°C/W |
Thermal Conductivity | 2.5 W/m-K |
Shape | Square |
Series | TGF25 |
Outline | 199.90mm x 199.90mm |
Material | Aluminum Oxide filled Silicone |
Manufacturer Standard Lead Time | 4 Weeks |
Detailed Description | Thermal Pad Yellow 199.90mm x 199.90mm Square |
Color | Yellow |
Backing, Carrier | - |
Adhesive | - |