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Standard Packaging Integrated Circuit Components 60-12-4661-1674
Usage | DO-5 |
---|---|
Type | Insulator Pad, Sheet |
Thickness | 0.0100" (0.254mm) |
Thermal Resistivity | - |
Thermal Conductivity | 1.0 W/m-K |
Shape | Round |
Series | CHO-THERM® 1674 |
Outline | 25.40mm Dia |
Other Names | 1944-1302 60-12-4661-1674-DK |
Moisture Sensitivity Level (MSL) | Not Applicable |
Material | - |
Manufacturer Standard Lead Time | 4 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Thermal Pad Blue 25.40mm Dia Round Adhesive - One Side |
Color | Blue |
Backing, Carrier | Fiberglass |
Adhesive | Adhesive - One Side |