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Standard Packaging Integrated Circuit Components PMXB56ENZ
Vgs(th) (Max) @ Id | 2V @ 250µA |
---|---|
Vgs (Max) | ±20V |
Technology | MOSFET (Metal Oxide) |
Supplier Device Package | DFN1010D-3 |
Series | - |
Rds On (Max) @ Id, Vgs | 55 mOhm @ 3.2A, 10V |
Power Dissipation (Max) | 400mW (Ta), 8.33W (Tc) |
Packaging | Tape & Reel (TR) |
Package / Case | 3-XDFN Exposed Pad |
Other Names | 1727-1477-2 1727-1477-2-ND 1727-2313-2 568-10948-2 568-10948-2-ND 568-12599-2 568-12599-2-ND 934067234115 934067234147 PMXB56EN PMXB56ENZ-ND |
Operating Temperature | -55°C ~ 150°C (TJ) |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Manufacturer Standard Lead Time | 8 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Input Capacitance (Ciss) (Max) @ Vds | 209pF @ 15V |
Gate Charge (Qg) (Max) @ Vgs | 6.3nC @ 10V |
FET Type | N-Channel |
FET Feature | - |
Drive Voltage (Max Rds On, Min Rds On) | 4.5V, 10V |
Drain to Source Voltage (Vdss) | 30V |
Detailed Description | N-Channel 30V 3.2A (Ta) 400mW (Ta), 8.33W (Tc) Surface Mount DFN1010D-3 |
Current - Continuous Drain (Id) @ 25°C | 3.2A (Ta) |