Label and body marking of IRF5805TRPBF can be provided after order.
In stock: 3
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Standard Packaging Integrated Circuit Components IRF5805TRPBF
Vgs(th) (Max) @ Id | 2.5V @ 250µA |
---|---|
Vgs (Max) | ±20V |
Technology | MOSFET (Metal Oxide) |
Supplier Device Package | Micro6™(TSOP-6) |
Series | HEXFET® |
Rds On (Max) @ Id, Vgs | 98 mOhm @ 3.8A, 10V |
Power Dissipation (Max) | 2W (Ta) |
Packaging | Cut Tape (CT) |
Package / Case | SOT-23-6 Thin, TSOT-23-6 |
Other Names | IRF5805TRPBFCT |
Operating Temperature | -55°C ~ 150°C (TJ) |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Input Capacitance (Ciss) (Max) @ Vds | 511pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs | 17nC @ 10V |
FET Type | P-Channel |
FET Feature | - |
Drive Voltage (Max Rds On, Min Rds On) | 4.5V, 10V |
Drain to Source Voltage (Vdss) | 30V |
Detailed Description | P-Channel 30V 3.8A (Ta) 2W (Ta) Surface Mount Micro6™(TSOP-6) |
Current - Continuous Drain (Id) @ 25°C | 3.8A (Ta) |