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Standard Packaging Integrated Circuit Components TSM900N10CH X0G
Vgs(th) (Max) @ Id | 2.5V @ 250µA |
---|---|
Vgs (Max) | ±20V |
Technology | MOSFET (Metal Oxide) |
Supplier Device Package | TO-251 (IPAK) |
Series | - |
Rds On (Max) @ Id, Vgs | 90 mOhm @ 5A, 10V |
Power Dissipation (Max) | 50W (Tc) |
Packaging | Tube |
Package / Case | TO-251-3 Stub Leads, IPak |
Other Names | TSM900N10CH X0G-ND TSM900N10CHX0G |
Operating Temperature | -55°C ~ 150°C (TJ) |
Mounting Type | Through Hole |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Manufacturer Standard Lead Time | 30 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Input Capacitance (Ciss) (Max) @ Vds | 1480pF @ 50V |
Gate Charge (Qg) (Max) @ Vgs | 9.3nC @ 10V |
FET Type | N-Channel |
FET Feature | - |
Drive Voltage (Max Rds On, Min Rds On) | 4.5V, 10V |
Drain to Source Voltage (Vdss) | 100V |
Detailed Description | N-Channel 100V 15A (Tc) 50W (Tc) Through Hole TO-251 (IPAK) |
Current - Continuous Drain (Id) @ 25°C | 15A (Tc) |