Label and body marking of HBM10DSEF can be provided after order.
In stock: 59175
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Standard Packaging Integrated Circuit Components HBM10DSEF
Termination | Solder Eyelet(s) |
---|---|
Series | - |
Read Out | Dual |
Pitch | 0.156" (3.96mm) |
Packaging | Tray |
Operating Temperature | -65°C ~ 125°C |
Number of Rows | 2 |
Number of Positions/Bay/Row | 10 |
Number of Positions | 20 |
Mounting Type | Panel Mount |
Material - Insulation | Polybutylene Terephthalate (PBT) |
Manufacturer Standard Lead Time | 3 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Gender | Female |
Flange Feature | Top Mount Opening, Floating Bobbin, 0.116" (2.95mm) Dia |
Features | - |
Contact Type | Full Bellows |
Contact Material | Beryllium Copper |
Contact Finish Thickness | 10.0µin (0.25µm) |
Contact Finish | Gold |
Color | Blue |
Card Type | Non Specified - Dual Edge |
Card Thickness | 0.062" (1.57mm) |