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Standard Packaging Integrated Circuit Components TSM500P02DCQ RFG
Vgs(th) (Max) @ Id | 800mV @ 250µA |
---|---|
Supplier Device Package | 6-TDFN (2x2) |
Series | - |
Rds On (Max) @ Id, Vgs | 50 mOhm @ 3A, 4.5V |
Power - Max | 620mW |
Packaging | Cut Tape (CT) |
Package / Case | 6-VDFN Exposed Pad |
Other Names | TSM500P02DCQ RFGCT TSM500P02DCQ RFGCT-ND TSM500P02DCQRFGCT |
Operating Temperature | -50°C ~ 150°C (TJ) |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Manufacturer Standard Lead Time | 28 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Input Capacitance (Ciss) (Max) @ Vds | 1230pF @ 10V |
Gate Charge (Qg) (Max) @ Vgs | 9.6nC @ 4.5V |
FET Type | 2 P-Channel (Dual) |
FET Feature | Standard |
Drain to Source Voltage (Vdss) | 20V |
Detailed Description | Mosfet Array 2 P-Channel (Dual) 20V 4.7A (Tc) 620mW Surface Mount 6-TDFN (2x2) |
Current - Continuous Drain (Id) @ 25°C | 4.7A (Tc) |