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Standard Packaging Integrated Circuit Components EYG-S0508ZLMJ
Usage | IGBT - Heat Transfer Low Thermal Resistance |
---|---|
Type | Graphite-Pad, Sheet |
Thickness | 0.0079" (0.200mm) |
Thermal Resistivity | - |
Thermal Conductivity | 20 W/m-K |
Shape | Rectangular |
Series | Soft-PGS |
Outline | 83.00mm x 46.20mm |
Other Names | EYGS0508ZLMJ P122011 |
Moisture Sensitivity Level (MSL) | Not Applicable |
Material | Graphite |
Manufacturer Standard Lead Time | 9 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Thermal Pad Gray 83.00mm x 46.20mm Rectangular |
Color | Gray |
Backing, Carrier | - |
Adhesive | - |