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Standard Packaging Integrated Circuit Components TG-CJP-12-LI98
Width | 0.472" (12.00mm) |
---|---|
Type | Top Mount |
Thermal Resistance @ Natural | - |
Thermal Resistance @ Forced Air Flow | - |
Shape | Square, Pin Fins |
Series | - |
Power Dissipation @ Temperature Rise | - |
Package Cooled | - |
Other Names | 1168-2211 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material Finish | - |
Material | Ceramic |
Manufacturer Standard Lead Time | 4 Weeks |
Length | 0.472" (12.00mm) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Height Off Base (Height of Fin) | 0.394" (10.00mm) |
Diameter | - |
Detailed Description | Heat Sink Ceramic Top Mount |
Attachment Method | Thermal Tape, Adhesive (Included) |