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Standard Packaging Integrated Circuit Components BU200Z-178-HT
Type | DIP, 0.3" (7.62mm) Row Spacing |
---|---|
Termination Post Length | 0.059" (1.50mm) |
Termination | Solder |
Series | BU-178HT |
Pitch - Post | 0.100" (2.54mm) |
Pitch - Mating | 0.100" (2.54mm) |
Packaging | Tube |
Other Names | BU200Z178HT ED2206 |
Operating Temperature | -55°C ~ 125°C |
Number of Positions or Pins (Grid) | 20 (2 x 10) |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material Flammability Rating | UL94 V-0 |
Manufacturer Standard Lead Time | 12 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Housing Material | Polybutylene Terephthalate (PBT), Glass Filled |
Features | Open Frame |
Current Rating | 1A |
Contact Resistance | 7 mOhm |
Contact Material - Post | Brass |
Contact Material - Mating | Beryllium Copper |
Contact Finish Thickness - Post | Flash |
Contact Finish Thickness - Mating | 78.7µin (2.00µm) |
Contact Finish - Post | Copper |
Contact Finish - Mating | Gold |