In stock: 53878
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Standard Packaging Integrated Circuit Components APR19-19-28CB/A01
Width | 0.732" (18.60mm) |
---|---|
Type | Top Mount |
Thermal Resistance @ Natural | 13.15°C/W |
Thermal Resistance @ Forced Air Flow | 5.11°C/W @ 200 LFM |
Shape | Square, Pin Fins |
Series | APR |
Power Dissipation @ Temperature Rise | - |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Other Names | APR191928CBA01 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material Finish | Black Anodized |
Material | Aluminum Alloy |
Manufacturer Standard Lead Time | 12 Weeks |
Length | 0.732" (18.60mm) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Height Off Base (Height of Fin) | 1.087" (27.60mm) |
Diameter | - |
Detailed Description | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Alloy Top Mount |
Attachment Method | Thermal Tape, Adhesive (Included) |