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Standard Packaging Integrated Circuit Components BSM300D12P2E001
Vgs(th) (Max) @ Id | 4V @ 68mA |
---|---|
Supplier Device Package | Module |
Series | - |
Rds On (Max) @ Id, Vgs | - |
Power - Max | 1875W |
Packaging | Tray |
Package / Case | Module |
Operating Temperature | -40°C ~ 150°C (TJ) |
Mounting Type | Chassis Mount |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Manufacturer Standard Lead Time | 32 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Input Capacitance (Ciss) (Max) @ Vds | 35000pF @ 10V |
Gate Charge (Qg) (Max) @ Vgs | - |
FET Type | 2 N-Channel (Half Bridge) |
FET Feature | Silicon Carbide (SiC) |
Drain to Source Voltage (Vdss) | 1200V (1.2kV) |
Detailed Description | Mosfet Array 2 N-Channel (Half Bridge) 1200V (1.2kV) 300A (Tc) 1875W Chassis Mount Module |
Current - Continuous Drain (Id) @ 25°C | 300A (Tc) |