In stock: 2
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Standard Packaging Integrated Circuit Components BGA0001-S
Type | BGA |
---|---|
Thickness | 0.0040" (0.102mm) |
Thermal Center Pad | - |
Series | Proto-Advantage |
Pitch | 0.031" (0.80mm) |
Outer Dimension | 0.900" L x 1.300" W (22.86mm x 33.02mm) |
Other Names | BGA0001S |
Number of Positions | 100 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material | Stainless Steel |
Manufacturer Standard Lead Time | 2 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Inner Dimension | - |