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Standard Packaging Integrated Circuit Components EYG-T7070A30A
Usage | Through-Plane Heat Transfer |
---|---|
Type | Pad, Sheet |
Thickness | 0.118" (3.00mm) |
Thermal Resistivity | 2.36°C/W |
Thermal Conductivity | 13 W/m-K |
Shape | Square |
Series | Graphite-PAD |
Outline | 70.00mm x 70.00mm |
Other Names | EYGT7070A30A P121375 |
Moisture Sensitivity Level (MSL) | Not Applicable |
Material | Graphite Resin |
Manufacturer Standard Lead Time | 9 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Thermal Pad Black 70.00mm x 70.00mm Square Adhesive - Both Sides |
Color | Black |
Backing, Carrier | - |
Adhesive | Adhesive - Both Sides |