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Standard Packaging Integrated Circuit Components GPEMI1.0-0.100-01-0816
Usage | - |
---|---|
Type | Pad, Sheet |
Thickness | 0.100" (2.54mm) |
Thermal Resistivity | - |
Thermal Conductivity | 1.0 W/m-K |
Shape | Rectangular |
Series | Gap Pad® EMI 1.0 |
Outline | 406.40mm x 203.20mm |
Other Names | BER355 PN0004232 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material | - |
Manufacturer Standard Lead Time | 2 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Thermal Pad Black 406.40mm x 203.20mm Rectangular Tacky - One Side |
Color | Black |
Backing, Carrier | Fiberglass |
Adhesive | Tacky - One Side |