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Standard Packaging Integrated Circuit Components SI8900EDB-T2-E1
Vgs(th) (Max) @ Id | 1V @ 1.1mA |
---|---|
Supplier Device Package | 10-Micro Foot™ CSP (2x5) |
Series | TrenchFET® |
Rds On (Max) @ Id, Vgs | - |
Power - Max | 1W |
Packaging | Tape & Reel (TR) |
Package / Case | 10-UFBGA, CSPBGA |
Other Names | SI8900EDB-T2-E1TR |
Operating Temperature | -55°C ~ 150°C (TJ) |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Manufacturer Standard Lead Time | 13 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Input Capacitance (Ciss) (Max) @ Vds | - |
Gate Charge (Qg) (Max) @ Vgs | - |
FET Type | 2 N-Channel (Dual) Common Drain |
FET Feature | Logic Level Gate |
Drain to Source Voltage (Vdss) | 20V |
Detailed Description | Mosfet Array 2 N-Channel (Dual) Common Drain 20V 5.4A 1W Surface Mount 10-Micro Foot™ CSP (2x5) |
Current - Continuous Drain (Id) @ 25°C | 5.4A |
Base Part Number | SI8900 |