In stock: 53502
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Standard Packaging Integrated Circuit Components 4664
Usage | TO-66 |
---|---|
Type | Die-Cut Pad, Sheet |
Thickness | 0.0030" (0.076mm) |
Thermal Resistivity | - |
Thermal Conductivity | - |
Shape | Rhombus |
Series | - |
Outline | 38.10mm x 19.05mm |
Other Names | 36-4664 4664K 4664K-ND |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material | Mica |
Manufacturer Standard Lead Time | 6 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Thermal Pad 38.10mm x 19.05mm Rhombus |
Color | - |
Backing, Carrier | - |
Adhesive | - |