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Standard Packaging Integrated Circuit Components 1-1542002-1
Width | - |
---|---|
Type | - |
Thermal Resistance @ Natural | 12.00°C/W |
Thermal Resistance @ Forced Air Flow | 6.30°C/W @ 200 LFM |
Shape | Cylindrical |
Series | - |
Power Dissipation @ Temperature Rise | - |
Package Cooled | BGA |
Other Names | 115420021 HTS365-U |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material Finish | Black Anodized |
Material | Aluminum |
Manufacturer Standard Lead Time | 11 Weeks |
Length | - |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Height Off Base (Height of Fin) | 0.357" (9.07mm) |
Diameter | 1.375" (34.92mm) OD |
Detailed Description | Heat Sink BGA Aluminum |
Attachment Method | Clip |