In stock: 59915
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Standard Packaging Integrated Circuit Components FDM3300NZ
Vgs(th) (Max) @ Id | 1.5V @ 250µA |
---|---|
Supplier Device Package | 8-MLP (3x3) |
Series | PowerTrench® |
Rds On (Max) @ Id, Vgs | 23 mOhm @ 10A, 4.5V |
Power - Max | 900mW |
Packaging | Tape & Reel (TR) |
Package / Case | 8-WFDFN Exposed Pad |
Operating Temperature | -55°C ~ 150°C (TJ) |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Input Capacitance (Ciss) (Max) @ Vds | 1610pF @ 10V |
Gate Charge (Qg) (Max) @ Vgs | 17nC @ 4.5V |
FET Type | 2 N-Channel (Dual) |
FET Feature | Logic Level Gate |
Drain to Source Voltage (Vdss) | 20V |
Detailed Description | Mosfet Array 2 N-Channel (Dual) 20V 10A 900mW Surface Mount 8-MLP (3x3) |
Current - Continuous Drain (Id) @ 25°C | 10A |