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Standard Packaging Integrated Circuit Components DS34S132GNA2+
Voltage - Supply | 1.8V, 3.3V |
---|---|
Supplier Device Package | 676-TEPBGA (27x27) |
Series | - |
Packaging | Tray |
Package / Case | 676-BGA |
Operating Temperature | -40°C ~ 85°C |
Number of Circuits | 1 |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Interface | TDMoP |
Includes | - |
Function | TDM-over-Packet (TDMoP) |
Detailed Description | Telecom IC TDM-over-Packet (TDMoP) 676-TEPBGA (27x27) |
Current - Supply | - |
Base Part Number | DS34S132 |