In stock: 105
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Standard Packaging Integrated Circuit Components TGF15-07870787-020
Usage | - |
---|---|
Type | Gap Filler Pad, Sheet |
Thickness | 0.0200" (0.508mm) |
Thermal Resistivity | 1.50°C/W |
Thermal Conductivity | 1.5 W/m-K |
Shape | Square |
Series | TGF15 |
Outline | 199.90mm x 199.90mm |
Other Names | 1798-1245 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material | Aluminum Oxide filled Silicone |
Manufacturer Standard Lead Time | 5 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Thermal Pad Pink 199.90mm x 199.90mm Square Tacky - Both Sides |
Color | Pink |
Backing, Carrier | - |
Adhesive | Tacky - Both Sides |