Label and body marking of HSC30DRAN-S734 can be provided after order.
In stock: 56169
We are stocking distributor of HSC30DRAN-S734 with very competitive price. Check out HSC30DRAN-S734 newest pirce, inventory and lead time now by using the quick RFQ Form. Our commitment to quality and authenticity of HSC30DRAN-S734 is unwavering, and we have implemented stringent quality inspection and delivery processes to ensure the integrity of HSC30DRAN-S734. You can also find HSC30DRAN-S734 Datasheet here.
Standard Packaging Integrated Circuit Components HSC30DRAN-S734
Termination | Solder |
---|---|
Series | - |
Read Out | Dual |
Pitch | 0.100" (2.54mm) |
Packaging | Tray |
Operating Temperature | -65°C ~ 125°C |
Number of Rows | 2 |
Number of Positions/Bay/Row | 30 |
Number of Positions | 60 |
Mounting Type | Through Hole, Right Angle |
Material - Insulation | Polybutylene Terephthalate (PBT) |
Manufacturer Standard Lead Time | 3 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Gender | Female |
Flange Feature | - |
Features | - |
Contact Type | Full Bellows |
Contact Material | Beryllium Copper |
Contact Finish Thickness | 10.0µin (0.25µm) |
Contact Finish | Gold |
Color | Blue |
Card Type | Non Specified - Dual Edge |
Card Thickness | 0.031" (0.79mm) |