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Standard Packaging Integrated Circuit Components 260-4T5E
Width | 0.380" (9.65mm) |
---|---|
Type | Board Level |
Thermal Resistance @ Natural | 14.00°C/W |
Thermal Resistance @ Forced Air Flow | - |
Shape | Cylindrical |
Series | 260 |
Power Dissipation @ Temperature Rise | - |
Package Cooled | TO-5 |
Other Names | 2604T5E 345-1013 |
Moisture Sensitivity Level (MSL) | Not Applicable |
Material Finish | Black Ebonol |
Material | Beryllium Copper |
Manufacturer Standard Lead Time | 8 Weeks |
Length | 0.370" (9.40mm) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Height Off Base (Height of Fin) | - |
Diameter | 0.290" (7.37mm) ID |
Detailed Description | Heat Sink TO-5 Beryllium Copper Board Level |
Attachment Method | Bolt On |