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Standard Packaging Integrated Circuit Components DC0025/01-H48-2K-0.1
Usage | SIP |
---|---|
Type | Die-Cut Pad, Sheet |
Thickness | 0.0039" (0.100mm) |
Thermal Resistivity | - |
Thermal Conductivity | 1.8 W/m-K |
Shape | Rectangular |
Series | H48-2K |
Outline | 36.83mm x 21.29mm |
Other Names | 1168-1491 DC002501H482K01 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material | Silicone |
Manufacturer Standard Lead Time | 12 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Thermal Pad Red 36.83mm x 21.29mm Rectangular |
Color | Red |
Backing, Carrier | - |
Adhesive | - |