In stock: 54048
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Standard Packaging Integrated Circuit Components HP1-TO3-CB
Width | 2.500" (63.50mm) |
---|---|
Type | Board Level |
Thermal Resistance @ Natural | 5.40°C/W |
Thermal Resistance @ Forced Air Flow | - |
Shape | Square, Pin Fins |
Series | HP1 |
Power Dissipation @ Temperature Rise | - |
Package Cooled | TO-3 |
Other Names | 294-1088 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material Finish | Black Anodized |
Material | Aluminum |
Length | 2.500" (63.50mm) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Height Off Base (Height of Fin) | 0.900" (22.86mm) |
Diameter | - |
Detailed Description | Heat Sink TO-3 Aluminum Board Level |
Attachment Method | Bolt On |