Label and body marking of HSEC8-1100-01-S-DV-A-BL-K can be provided after order.
In stock: 57826
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Standard Packaging Integrated Circuit Components HSEC8-1100-01-S-DV-A-BL-K
Termination | Solder |
---|---|
Series | Edge Rate™ HSEC8 |
Read Out | Dual |
Pitch | 0.031" (0.80mm) |
Packaging | Tray |
Operating Temperature | -55°C ~ 125°C |
Number of Rows | 2 |
Number of Positions/Bay/Row | 100 |
Number of Positions | 200 |
Mounting Type | Surface Mount |
Material - Insulation | Liquid Crystal Polymer (LCP) |
Manufacturer Standard Lead Time | 3 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Gender | Female |
Flange Feature | - |
Features | Board Guide, Board Lock |
Contact Type | Cantilever |
Contact Material | Beryllium Copper |
Contact Finish Thickness | 30.0µin (0.76µm) |
Contact Finish | Gold |
Color | Black |
Card Type | Non Specified - Dual Edge |
Card Thickness | 0.063" (1.60mm) |