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Standard Packaging Integrated Circuit Components SIR180DP-T1-RE3
Vgs(th) (Max) @ Id | 3.6V @ 250µA |
---|---|
Vgs (Max) | ±20V |
Technology | MOSFET (Metal Oxide) |
Supplier Device Package | PowerPAK® SO-8 |
Series | TrenchFET® Gen IV |
Rds On (Max) @ Id, Vgs | 2.05 mOhm @ 10A, 10V |
Power Dissipation (Max) | 5.4W (Ta), 83.3W (Tc) |
Packaging | Cut Tape (CT) |
Package / Case | PowerPAK® SO-8 |
Other Names | SIR180DP-T1-RE3CT |
Operating Temperature | -55°C ~ 150°C (TJ) |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Manufacturer Standard Lead Time | 32 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Input Capacitance (Ciss) (Max) @ Vds | 4030pF @ 30V |
Gate Charge (Qg) (Max) @ Vgs | 87nC @ 10V |
FET Type | N-Channel |
FET Feature | - |
Drive Voltage (Max Rds On, Min Rds On) | 7.5V, 10V |
Drain to Source Voltage (Vdss) | 60V |
Detailed Description | N-Channel 60V 32.4A (Ta), 60A (Tc) 5.4W (Ta), 83.3W (Tc) Surface Mount PowerPAK® SO-8 |
Current - Continuous Drain (Id) @ 25°C | 32.4A (Ta), 60A (Tc) |