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Standard Packaging Integrated Circuit Components RP-SEMC32DA1
Write Cycle Time - Word, Page | - |
---|---|
Voltage - Supply | 2.7 V ~ 3.6 V |
Technology | FLASH - NAND |
Supplier Device Package | 153-FBGA (11.5x13) |
Series | Automotive, AEC-Q100, MC |
Packaging | Bulk |
Package / Case | 153-LFBGA |
Other Names | P122050 RPSEMC32DA1 |
Operating Temperature | -40°C ~ 85°C |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Memory Type | Non-Volatile |
Memory Size | 256Gb (32G x 8) |
Memory Interface | eMMC |
Memory Format | FLASH |
Manufacturer Standard Lead Time | 17 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | FLASH - NAND Memory IC 256Gb (32G x 8) eMMC 153-FBGA (11.5x13) |