Label and body marking of DIP050-628-157BLF can be provided after order.
In stock: 51707
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Standard Packaging Integrated Circuit Components DIP050-628-157BLF
Type | DIP, 0.6" (15.24mm) Row Spacing |
---|---|
Termination Post Length | 0.095" (2.41mm) |
Termination | Solder |
Series | - |
Pitch - Post | 0.100" (2.54mm) |
Pitch - Mating | 0.100" (2.54mm) |
Packaging | Tube |
Operating Temperature | - |
Number of Positions or Pins (Grid) | 28 (2 x 14) |
Mounting Type | Through Hole |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material Flammability Rating | UL94 V-0 |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
Features | Open Frame |
Contact Resistance | - |
Contact Material - Post | Brass |
Contact Material - Mating | Beryllium Copper |
Contact Finish Thickness - Post | 200.0µin (5.08µm) |
Contact Finish Thickness - Mating | 100.0µin (2.54µm) |
Contact Finish - Post | Tin |
Contact Finish - Mating | Tin |