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Standard Packaging Integrated Circuit Components SI3456BDV-T1-GE3
Vgs(th) (Max) @ Id | 3V @ 250µA |
---|---|
Vgs (Max) | ±20V |
Technology | MOSFET (Metal Oxide) |
Supplier Device Package | 6-TSOP |
Series | TrenchFET® |
Rds On (Max) @ Id, Vgs | 35 mOhm @ 6A, 10V |
Power Dissipation (Max) | 1.1W (Ta) |
Packaging | Tape & Reel (TR) |
Package / Case | SOT-23-6 Thin, TSOT-23-6 |
Operating Temperature | -55°C ~ 150°C (TJ) |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Gate Charge (Qg) (Max) @ Vgs | 13nC @ 10V |
FET Type | N-Channel |
FET Feature | - |
Drive Voltage (Max Rds On, Min Rds On) | 4.5V, 10V |
Drain to Source Voltage (Vdss) | 30V |
Detailed Description | N-Channel 30V 4.5A (Ta) 1.1W (Ta) Surface Mount 6-TSOP |
Current - Continuous Drain (Id) @ 25°C | 4.5A (Ta) |