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Standard Packaging Integrated Circuit Components SI5509DC-T1-E3
Vgs(th) (Max) @ Id | 2V @ 250µA |
---|---|
Supplier Device Package | 1206-8 ChipFET™ |
Series | TrenchFET® |
Rds On (Max) @ Id, Vgs | 52 mOhm @ 5A, 4.5V |
Power - Max | 4.5W |
Packaging | Tape & Reel (TR) |
Package / Case | 8-SMD, Flat Lead |
Other Names | SI5509DC-T1-E3TR SI5509DCT1E3 |
Operating Temperature | -55°C ~ 150°C (TJ) |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Input Capacitance (Ciss) (Max) @ Vds | 455pF @ 10V |
Gate Charge (Qg) (Max) @ Vgs | 6.6nC @ 5V |
FET Type | N and P-Channel |
FET Feature | Logic Level Gate |
Drain to Source Voltage (Vdss) | 20V |
Detailed Description | Mosfet Array N and P-Channel 20V 6.1A, 4.8A 4.5W Surface Mount 1206-8 ChipFET™ |
Current - Continuous Drain (Id) @ 25°C | 6.1A, 4.8A |
Base Part Number | SI5509 |