Label and body marking of HBC18HEYI can be provided after order.
In stock: 58569
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Standard Packaging Integrated Circuit Components HBC18HEYI
Termination | Solder |
---|---|
Series | - |
Read Out | Single |
Pitch | 0.100" (2.54mm) |
Packaging | Tray |
Operating Temperature | -65°C ~ 125°C |
Number of Rows | 1 |
Number of Positions/Bay/Row | - |
Number of Positions | 18 |
Mounting Type | Through Hole |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material - Insulation | Polybutylene Terephthalate (PBT) |
Manufacturer Standard Lead Time | 3 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Gender | Female |
Flange Feature | Top Mount Opening, Threaded Insert, 4-40 |
Features | - |
Contact Type | Cantilever |
Contact Material | Beryllium Copper |
Contact Finish Thickness | 10.0µin (0.25µm) |
Contact Finish | Gold |
Color | - |
Card Type | Non Specified - Dual Edge |
Card Thickness | 0.062" (1.57mm) |