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Standard Packaging Integrated Circuit Components XQ7Z030-1RF676Q
Voltage - Breakdown | 676-FCBGA (27x27) |
---|---|
Series | Zynq®-7000Q |
Secondary Attributes | Kintex™-7 FPGA, 125K Logic Cells |
RoHS Status | Tray |
Reverse Recovery Time (trr) | 667MHz |
Requires | DMA |
Reference Type | MCU, FPGA |
Program Memory Size | CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Polarization | 676-BBGA, FCBGA |
Operating Temperature | -40°C ~ 125°C (TJ) |
Operating System | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Multiplexer/Demultiplexer Circuit | 256KB |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Manufacturer Standard Lead Time | 6 Weeks |
Manufacturer Part Number | XQ7Z030-1RF676Q |
MCU RAM | - |
Expanded Description | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000Q Kintex™-7 FPGA, 125K Logic Cells 256KB 667MHz 676-FCBGA (27x27) |
Description | IC FPGA QPRO 676BGA |
Clock Rate | 130 |